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tlp18 2 2013 - 9 - 1 3 1 toshiba photocoupler in gaas infrared led & photo ? transistor TLP182 telephone use equipment programmable controllers ac / dc ? input module telecommunication tlp18 2 consist of photo transistor, optically coupled to two ingaas infrared emitting diode connected inverse parallel, and can operate directly by low ac input current . tlp18 2 are guaranteed wide operating temperature (ta = -55 to 1 25 ?c) and high isolation voltage (3750vrms), its suitable for switching power supplies and hybrid ics. ? collector - emitter voltage : 80v (min) ? current transfer ratio : 50% (min) rank gb : 100% (min) ? isolation voltage : 3750 vrms (min) ? operation temperature : - 55 to 125 ?c ? ul recognized : ul1577 , file no. e67349 ? cul approved : csa component acceptance service no.5a , file no. e67349 ? option ( v4) vde approved : din en 60747 - 5 -5 , approved no. 40009347 (note) when an en 60747 -5 - 5 approved type is needed, please designate the option(v4) ? construction mechanical rating creepage distance : 5.0 mm(min) clearance : 5.0 mm(min) insulation thickness : 0.4 mm(min) jedec - jeita - toshiba 11 - 4m1s weight: 0.08 g (typ.) pin configuration 6 1 : anode, cathode 3 : cathode, anode 4 : emitter 6 : collector 4 1 3 unit: mm
tlp18 2 2013 - 9 - 1 3 2 current t ransfer r atio ( unless otherwise specified, ta = 25c ) note1: specify both the part number and a rank in this format when ordering (e.g.) r ank gb: TLP182 (gb,e for safety standard certification, however, specify the part number alone. (e.g.) tlp1 82 (gb,e: tlp 182 rank ( note 1 ) test condition current transfer ratio marking of classification unit i c / i f min max blank i f = 5 ma, v ce = 5 v 50 600 blank , ye, gr, gb, bl % i f = 0.5 ma, v ce = 5 v y i f = 5 ma, v ce = 5 v 50 150 y e i f = 0.5 ma, v ce = 5 v gr i f = 5 ma, v ce = 5 v 100 300 g r i f = 0.5 ma, v ce = 5 v gb i f = 5 ma, v ce = 5 v 100 600 gb i f = 0.5 ma, v ce = 5 v b l i f = 5 ma, v ce = 5 v 200 600 b l i f = 0.5 ma, v ce = 5 v
tlp18 2 2013 - 9 - 1 3 3 absolute maximum ratings (note ) ( unless otherwise specified, ta = 25c ) characteristic symbol note rating unit led r.m.s. f orward current i f (rms) 50 m a input f orward current derating (ta 90 c) i f / ta - 1.5 ma / c input forward current (pulsed) i fp (note 2) 1 a junction temperature t j 125 c detector collector ? emitter voltage v ceo 80 v emitter ? collector voltage v eco 7 v collector current i c 50 m a collector p ower dissipation p c 150 m w power dissipation derating (ta 25 c) p c / ta - 1.5 mw / c junction temperature t j 125 c operating temperature range t opr ?55 to 125 c storage temperature range t stg ?55 to 125 c l ead soldering temperature t sol 260 (10s) c total package power dissipation p t 200 m w total package power dissipation derating (ta 25 c) p t / ta - 2.0 mw / c isolation voltage bv s (note 3) 3750 vrms note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. opera ting temperature/current/voltage, etc.) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (handling precautions/ derating concept and methods ) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). note 2 : pulse width 100 s, f requency 100 hz note 3 : ac, 1min., r.h. 60%, device considered a two terminal device: led side p ins shorted together and dete ctor side pins sho rted together.
tlp18 2 2013 - 9 - 1 3 4 electrical characteristics ( unless otherwise specified, ta = 25c ) characteristic symbol test condition min typ. max unit led input f orward voltage v f i f = 10 ma 1.1 1.25 1.4 v input c apacitance c t v = 0 v , f = 1 mhz - 60 - pf detector collector ? emitter breakdown voltage v (br) ceo i c = 0.5 ma 80 - - v emitter ? collector breakdown voltage v (br) eco i e = 0.1 ma 7 - - v collector dark current i dark v ce = 48 v - 0.01 0.08 a v ce = 48 v , ta = 85 c - 2 50 a collector - emitter c apacitance c ce v = 0 v , f = 1 mhz - 10 - pf coupled electrical characteristics ( unless otherwise specified, ta = 25c ) characteristic symbol test condition m i n typ. max unit current transfer ratio i c / i f i f = 5 ma, v ce = 5 v 50 - 600 % rank gb 100 - 600 i f = 0.5 ma, v ce = 5 v 50 - 600 rank gb 100 - 600 saturated ctr i c / i f (sat) i f = 1 ma, v ce = 0.4 v - 60 - % rank gb 50 - - collector ? emitter saturation voltage v ce (sat) i c = 2 .4 ma, i f = 8 ma - - 0.3 v i c = 0.2 ma, i f = 1 ma - 0.2 - rank gb - - 0.3 off ? state collector current i c(off) v f = 0.7 v, v ce = 48 v - 1 10 a collector current ratio i c (ratio) i c (i f = - 5 ma) / i c (i f = 5 ma) ( fig 1) 0.33 - 3 fig. 1 : collector current ratio test circuit i c (ratio)= 5v) ce v , f1 i f (i c1 i 5v) ce v , f2 i f (i c2 i = = = = i c1 i c2 v ce i f1 i f2
tlp18 2 2013 - 9 - 1 3 5 isolation characteristics ( unless otherwise specified, ta = 25c ) characteristic symbol test condition min typ. max unit total c apacitance ( input to output ) c s v s = 0 v, f = 1 mhz - 0.8 - pf isolation resistance r s v s = 500 v, r.h. 60% 1 10 10 10 14 - isolation voltage bv s ac, 1 minute 3750 - - v rms ac, 1 second, in oil - 10000 - dc, 1 minute, in oil - 10000 - v dc switching characteristics ( unless otherwise specified, ta = 25c ) characteristic symbol test condition min typ. max unit rise time t r v cc = 10 v, i c = 2 ma r l = 100 D 2 D s fall time t f D 3 D turn ? on time t on D 3 D turn ? off time t off D 3 D turn ? on time ton r l = 1.9 k (fig.2 ) v cc = 5 v, i f = 16 ma D 0.4 D storage time ts D 20 D turn ? off time toff D 35 D turn ? on time t on r l = 4.7 k (fig.2 ) v cc = 5 v, i f = 1 .6 ma D 4 D s storage time t s D 7 D turn ? off time t off D 30 D fig. 2 : switching time test circuit t off t on v ce i f t s v cc 4.5v 0.5v v cc r l i f v ce
tlp18 2 2013 - 9 - 1 3 6 characteristics curves (note) i f - ta p c - ta input forward current i f (ma) collector power dissipation p c (mw) ambient temperature ta (?c) ambient temperature ta (?c) i fp - d r i f - v f input forward current (pulsed) i fp (ma) input forward current i f (ma) duty cycle ratio d r input forward voltage v f (v) ? v f / ? ta - i f i f p C v f p input forward current temperature coefficient v f / ta (mv/ c ) input forward current (pulsed) i fp (ma) input forward current i f (ma) input forward voltage (pulsed) v fp (v) note: the above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. 0.001 0.01 0.1 1 pules width 100 s ta=25?c pulse width 10 s repeati ti ve frequency =100hz ta=25c this curve shows the maximum limit to the input forward current. this curve shows the maximum limit to the collector power dissipation . this curve shows the maximum limit to the input forward current (pulsed) . 1 25 ?c 1 1 0?c 85 ?c 50 ?c 25 ?c 0?c - 25 ?c - 55 ?c
tlp18 2 2013 - 9 - 1 3 7 i c - v ce i c - v ce collector current i c (ma) collector current i c (ma) collector - emitter voltage v ce (v) collector - emitter voltage v ce (v) i c - i f i c / i f - i f collector current i c (ma) current transfer ratio i c / i f (%) input forward voltage i f (ma) input forward current i f (ma) i dark - ta v ce(sat) - ta dark current i dark ( a ) collector - emitter saturation voltage v ce(sat) (v) ambient temperature ta ( c ) ambient temperature ta ( c ) note: the above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. v ce =10v v ce =5v v ce =0.4v v ce =10v v ce =5v v ce =0.4v i f =8ma, i c =2.4ma ta=25? c ta=25? c 5 ma 10 ma 15 ma 20 ma 30 ma 50 ma p c (max) 5 ma 10 ma 15 ma i f = 2 ma 20 ma 30 ma 50 ma ta=25? c v ce =48v i f = 2 ma ta=25? c
tlp18 2 2013 - 9 - 1 3 8 i c - ta collector current i c (ma) ambient temperature ta ( c ) switching time - r l switching time - ta switching time ( s ) switching time ( s ) load resistance r l (k ) ambient temperature ta ( c ) note: the above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. t off ta=25?c i f =16ma v cc =5v i f =16ma v cc =5v r l =1 .9k ? t s t on t off t s t on v ce =5v i f =0.5ma 5 ma
tlp18 2 2013 - 9 - 1 3 9 soldering and storage 1. soldering 1.1 soldering when using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as much as possible by observing the following conditions. 1) using solder reflow ? temperature profile example of lead (pb) solder ? temperature profile example of using lead (pb) - free solder reflow soldering must be performed once or twice. the mounting should be completed with the interval from the first to the last mountings being 2 weeks. 2) using solder flow (for lead (pb) solder, or lead (pb) - free solder) ? please preheat it at 150c between 60 and 120 seconds. ? complete soldering withi n 10 seconds below 260c. ? flow soldering must be performed once. 3) using a soldering iron complete soldering within 10 seconds below 260c, or within 3 seconds at 350c. each pin may be heated at most once. time (s) (c) 240 210 160 60 to 120s less than 30s package surface temperature 140 ti me (s) ( c ) 260 230 190 60 to 120s 30 to 50s 180 package surface temperature this profile is based on the devices maximum heat resistance guaranteed value. set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder pas te type used by the customer within the described profile. this profile is based on the devices maximum heat resistance guaranteed value. set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile.
tlp18 2 2013 - 9 - 1 3 10 2. storage 1) avoid storage locations where devices may be exposed to moisture or direct sunlight. 2) follow the precautions printed on the packing label of the device for transportation and storage. 3) keep the storage location temperature and humidity with in a range of 5c to 35c and 45% to 75%, respectively. 4) do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. 5) store the products in locations with minimal temperature fluctuations. rapid temp erature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. 6) when restoring devices after removal from their packing, use anti - static containers. 7) do not allow loads to be applied directly to devices while they are in storage. 8 ) if devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use.
tlp18 2 2013 - 9 - 1 3 11 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collectively "toshiba"), reserve the right to make changes to the i nformation in this document, and related hardware, software and systems (collectively "product") without notice. ? th is document and any information herein may not be reproduced without prior written permission from toshiba. even with toshiba's written permission, reproduction is permissible only if reproduction is without alteration/omission. ? though toshiba works cont inually to improve product's quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, softwar e and systems which minimize r isk and avoid situations in which a malfunction or failure of product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. before customers use the product, create designs including t he product, or incorpo rate the product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and applicatio n notes f or product and the precautions and conditions set forth in the "toshiba semiconductor reliability handbook" and (b) the instruct ions for the application with which the product will be used with or for. customers are solely responsible for all aspects of th eir own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such d esign or applications; (b) evaluating and determining the applicability of any information contained in this docume nt, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parame ters for such designs and applications. toshiba assumes no liability for customers' product design or a pplications. ? product is neither intended nor warranted for use in equipments or systems that require extraordinarily high levels of quality and/or reliability, and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage and/or serious public impact ( " unintended use " ). except for specific applications as expressly stated in this document, unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace indus try, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or ex plosions, safety devices, elevators and escalators, devices related to electric power, a nd equipment used in finance - related fields. if you use product for unintended use, toshiba assumes no liability for product. for details, please contact your toshiba sales representative. ? do not disassemble, analyze, reverse - engineer, alter, modify, tra nslate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited unde r any applicable laws or regulations. ? the information contained herein is presented only as guidance for product use. no responsibility is assumed by toshiba for any infringement of patents or any other intellectual property rights of third parties that may result from the use of product. n o license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provided in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba ( 1) assumes no liability whatsoever, including without limitation, indirect, consequential, special, or incidental damages or loss, including without limitation, loss of profits, loss of opportunities, business interruption and loss of data, and (2) disclai ms any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? gaas (galli um arsenide) is used in product. gaas is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose gaas in product. ? do not use or otherwi se make available product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technol ogy products ( mass destruction weapons). product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the japanese foreign exchange and foreign trade law and the u.s. export administration regulations. export and re - export of product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of product. please use product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled su bstances, including without limitation, the eu rohs directive. toshiba assumes n o liability for dama ges or losses occurring as a resul t of noncompliance w ith applicable laws and regulations.

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